Board Level Connectors

Interconnect products and solutions have always been the domain of excellence of Amphenol. As the world’s leading supplier of connections systems for military, aerospace and industry applications, we dedicate this experience to integrate our innovative solutions in the railway market. We are able to meet and exceed customer expectations with our committed, experienced personnel and with our use of the most advanced facilities and technologies available, from project planning to inspection. As a leading, innovative, global player in Interconnection and Interface Technologies we are constantly in touch with our customers in an effort to provide them with the best solutions for their application requirements.

SIHD

SIHD

FEATURES:
Monolithic staggered grid connector, with floating capability feature.

APPLICATIONS:
๏ Radar
๏ On Board Computer
๏ Actuator

HDAS

HDAS

FEATURES:
Monolithic high density PCB interconnect. Provides higher current rate capability, and extreme withstanding to harsh environments.

APPLICATIONS:
๏ On Board Computer
๏ Display Unit
๏ Actuator
๏ Engine
๏ Power Unit
๏ Landing Gear
๏ Braking System

HILINX

HILINX

FEATURES:
100% modular & hybrid connector. Unique M55302 modular interconnect. System of interlocking signal, power, fiber optics & HF modules.

APPLICATIONS:
๏ Engine
๏ Power Unit
๏ Landing Gear
๏ Braking System
๏ Ordnance

SMASH

SMASH

FEATURES:
Highly robust advanced SEM E form factor connector. For the most demanding electronic packagings interconnects.

APPLICATIONS:
๏ Radar
๏ Engine
๏ Ordnance

R-SATA

R-SATA

The new (Rugged) R-SATA style connector is perfectly suited as the primary internal storage interconnect for desktop and mobile PCs, connecting the system to peripherals such as hard drives, solid state drives, optical drives, and removable magnetic media drives. The R-SATA supports SATA 3.0 protocol, delivering 6.25 Gb/s data rates & beyond. Amphenol’s R-SATA connector utilizes a Micro-Hyperboloid contact with proven performance. The Micro-Hyperboloid contact system offers low insertion and extraction forces, high durability counts and is resistant to shock, vibration and fretting corrosion.
4 body styles for 7 pin & Combo 22 pin arrangements
Right Angle Plug (Daughterboard)
Straight Receptacle (Motherboard)
Right Angle Receptacle (PC)
Straight Plug - Parallel Boards

FEATURES & BENEFITS:
Ruggedized SATA style
Supports SATA 3.0 protocol (6.25 Gb/s) & beyond
Rugged Micro-Hyperboloid contacts
Low insertion/extraction force
20K mating cycles
Resistant to shock, vibration & fretting corrosion
7 pin SATA & Combo 22 pin R-SATA contact arrangements (two differential pairs, 3 ground)
Foot print compatible with 3M SATA Connectors

Power to Board

Power to Board

Amphenol RADSOK® solution offers options for high current single-point connections with a compact footprint design that can supply up to 120 Amps to the board. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. RADSOK® Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools.

HDB3 High Density/ HSB3 High Speed

HDB3 High Density/ HSB3 High Speed

This new connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors. HDB3 connectors utilize the same durable and reliable B3 brush contact in a tighter .070” X .060” staggered grid pattern.

FEATURES:
๏ 100,000 mating cycles
๏ Operating Temperature of -65°C to 125°C
๏ 36 unique keying combinations
๏ HSB3 data rates up to 6.25 Gbps