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Bergstak® 0.80mm Pitch

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS Amphenol ICC's BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions. Housing and terminal profile guarantees support of up to 12Gb/s Vertical versus vertical mating configuration 40 to 200 position sizes in 20 position increments 5mm to 20mm stack heights in 1mm increments

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Bergstak® 0.80mm Pitch
 
   
 
 
 
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