Complex Systems & Assemblies Filtre

Complex Systems & Assemblies

  • Amphenol provides printed circuit processing capabilities that are among the world's most advanced, specializing in high technology multilayer backplane applications. We are able to offer large panel sizes with high layer counts and features such as high-aspect ratio plating, small-diameter plated-through holes, and fine lines and spaces. Investments at this stage ensure predictable, repeatable manufacturability with reduced costs. We offer this in conjunction with the Amphenol Corporation's complete breadth of interconnect products, giving our customers a one-stop solution.
  • At Amphenol Borisch Technologies we understand that building complex assemblies requires a robust quality system, strong engineering support, and world-class operators. ABT will provide you with a dedicated Program Manager that has the resources and expertise to ensure you will receive excellent service.
  • At Amphenol Borisch Technologies we understand that high reliability electronics requires state-of-the art equipment, experienced and passionate people, and rigorous process validation. We work closely with our customers during the New Product Introduction (NPI) stage to ensure that products meet or exceeds all requirements and expectations right from the very start of the project.
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