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High Speed & Fiber Optic Connectors

  • CFP2
    CFP2
    Amphenol’s CFP2 (surface mount receptacle connector) is considered to be a candidate of future generation multi hundred Gbps systems. CFP2 is comprised of 104 position, 0.6mm pitch host and pluggable connectors. It is rated for 28 Gbps per channel with resonance dampening for improved signal integrity. The plug connector on the mating interface improves accuracy and aids in achieving high speed performance. The CFP2 interconnect system includes insert molding assemblies for top side contacts and press-fit cage assemblies complying with IEEE and ITU-T applications.
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  • CFP4
    CFP4
    Amphenol’s CFP2 (surface mount receptacle connector) is considered to be a candidate of future generation multi hundred Gbps systems. CFP2 is comprised of 104 position, 0.6 mm pitch host and pluggable connectors. It is rated for 28 Gbps per channel with resonance dampening for improved signal integrity. The plug connector on the mating interface improves accuracy and aids in achieving high speed performance. The CFP2 interconnect system includes insert molding assemblies for top side contacts and press-fit cage assemblies complying with IEEE and ITU-T applications.
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  • DDR4 Ultra Low Profile
    DDR4 Ultra Low Profile
    SPECIALLY DESIGNED SOCKETS FOR LOW PROFILE SYSTEM
    DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch and facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.
    Ultra low module seating height of 1.1mm
    Lowest connector height of 13.1mm
    Reduced overall profile of the connector
    Compatible with standard DIMM module to help optimize airflow
    Low resistance contacts (registered DIMM) reduces power consumption in hardware
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  • eQSFP
    eQSFP
    The eQSFP interconnect system is comprised of a 38 position 0.8 mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps / Channel, and replacing up to 4 standard SFP+ receptacles. These features result in greater port density and overall cost savings over traditional SFP+ products. Supporting standards include, Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options. eQSFP includes cages in single and ganged configurations with multiple heat sink options supporting various thermal requirements and port status with light pipes options.
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  • ExpressPort QSFP
    ExpressPort QSFP
    The ExpressPort QSFP+/QSFP interconnect system and the stacked combos are comprised of 38-position 0.8mm pitch SMT connectors, as well as press-fit cages intended for external connections. Each port offers 4 channels which increases port density and contributes to cost savings. The ExpressPort QSFP+ E-Series connector family is rated at 28 Gbps per channel. It features as tamped and formed contact design providing improved mechanical durability, an integrated grounding structure,and resonance dampening features for superior crosstalk performance. The contact design is optimized for a smooth impedance profile resulting in improved SI performance.
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  • ExpressPort SFP
    ExpressPort SFP
    Amphenol’s ExpressPort SFP+ 1xN connector, when combined with the ExpressPort SFP+ cage, provides data transfer speeds of up to 25 Gbps. This is the highest speed in the market for the SFP+ series. The design of the ExpressPort SFP+ connector minimizes impedance discontinuities and reflections at high data rates, and provides a 10 to 20 dB improvement in Near-End Cross talk. The connectors accept multiple transceivers per SFF-8431 and are compliant with SFF-8081 and SFF-8083 speci- fications. Our unique ExpressPort SFP+ cage features enhanced EMI shielding options in the form of metal spring fingers or elastomeric gaskets. Ganged versions are compliant with the SFF-8433 standard. The ExpressPort SFP+ 2xN combos consist of an integrated stacked connector system and a cage with compliant press-fit pins or solder tail.
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  • MiniSAS
    MiniSAS
    The Mini-SAS external I/O connector system consists of a die-cast metal cage and a Compact Multi Lane SMT connector. The Mini-SAS can support Fiber Channel and Infini-Band standards, making it the perfect solution to the ever-growing demand of high-speed mass storage systems, servers, and storage area networks. Providing four serial send/receive channels per port, this connector system provides signal speeds of 6 Gbps per channel across the connector interface and is designed to satisfy the needs for gigabit serial data transmission applications. The connector satisfies the requirements of the INCITS T10 SAS 2.0 and SAS 2.1, and is also compliant with SFF-8086 and SFF-8088. The cage is mounted separately to the body so that the stress imposed by insertion and removal of the cable plug does not affect the signal/body solder joints. The connector is available with unique solder hold-down tabs designed to provide additional mechanical robustness in demanding applications.
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  • MiniSAS HD
    MiniSAS HD
    The Mini-SAS High Density Interconnect is the next generation SAS system, with 4x, 8x and 16x cable-plugging options to provide faster data transmission and more bandwidth for end users. Our Mini-SAS HD is designed to be compliant with the SFF-8644 standard. It is also designed to save space with its increased density and reduced size as compared to the Mini-SAS 2.0. The Mini-SAS HD connector system has a 2-row, right angle connector with 12 Gbps per channel. Each connector handles 4 lanes of data for up to 48 Gbps of total bandwidth. Ganged options are also available up to a 1x4 configuration for up to 192 Gbps of total bandwidth. This connector will mate with active copper and optical cable assemblies, as well as active pluggable modules for extended-length applications in data centers. Main applications for Mini-SAS HD include HBA Servers, storage devices, and switches in data centers.
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  • OSFP
    OSFP
    The OSFP interconnect system has 60 contacts per port and supports 16 high speed pairs. With a 0.6mm contact pitch, 4 rows of contacts and a horizontal port pitch of 23.38mm, the OSFP footprint is optimized for signal integrity performance. The stacked connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications. An integrated heat sink for optimal thermal performance is a feature of the design.
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  • PCIe M.2 Connector
    PCIe M.2 Connector
    HIGH PERFORMANCE SMALL CARD CONNECTOR
    Amphenol ICC's PCI Express® (PCIe) M.2 occupies less board space, offers more connector height options and supports higher data rates than PCIe® Mini Card connector. This makes it an ideal option for tablets, laptops and low profile storage/server applications.
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  • RCx
    RCx
    RCx is a simple, high density, low cost, passive connector and cable system specifically designed for intra-rack connectivity of 25 Gb, 50 Gb and 100 Gb Ethernet allowing for a seamless intra-rack switch to adapter deployments. The streamlined design eliminates the need to include provision for active electrical components such as EEPROMs, optics, retimers, or management ICs. RCx is density optimized and can accommodate more than 128 25 G lanes in a RU faceplate. That leads two RCx2 receptables to fit on a half-height PCIe card faceplate or two Rcx4 to fit on a full-height PCIe card faceplate. Versatile, the 4-lane RCx4 receptacle can be used as a 4-lane port, or can be bifurcated to be used as multiple 2-lane and 1-lane ports.
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  • SFP
    SFP
    The SFP interconnect system consists of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It is designed to support Gigabit Ethernet and Fiber Channel applications. The connector accepts multiple transceivers per INF-8074i and combines,transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions ( 2XN ) consist of a 2-row cage with integrated connectors. The entire assembly in press-fit pin compliant. Main applications of the SFP series include servers, storage, switches, and networking equipment.
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  • UltraPort QSFP
    UltraPort QSFP
    The UltraPort QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The UltraPort QSFP+ connector supports next generation 100 G+ applications and transmits up to 32 Gbps per-serial-lane making it the fastest connector in the QSFP+ market. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 32 Gbps.
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  • UltraPort SFP
    UltraPort SFP
    The UltraPortTM SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Amphenol’s UltraPortTM SFP+ connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built for use with several board thicknesses and assembly processes to accommodate server and switch applications with great cost savings. The connector accepts multiple transceivers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. The entire assembly is press-fit pin compliant.
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  • UltraPort SlimSAS
    UltraPort SlimSAS
    Amphenol’s SlimLine SAS system addresses various interconnect issues in next generation storage devices such as bulk cable form factor restrictions and the introduction of multi lane storage devices. The 8-row, 0.6 mm pitch, 24 Gbps per lane internal solution consumes the same area as the MiniSAS HD 4x solution targeted for next generation SAS-4. The proven high-speed connector and ribbon cable friendly design supports blade and mainstream server designs.
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  • XCede IO
    XCede IO
    The XCede IO interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede IO connector supports next generation 100 G+ applications and transmits up to 28 Gbps per-serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes cross talk and transmission line impedance discontinuity across the connector interface at speeds up to 28 Gbps.
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  • XFP
    XFP
    The XFP interconnect system is capable of a 10 Gbps data rate and is intended for external I/O connections. High speed serial interconnect applications include clusters, servers, and storage devices. Its single row cage configuration requires less space and is a lower cost alternative to parallel-optics VSR. XFP also requires less than one-third the power and physical space of an MSA interconnect with parallel interface. It has a single footprint for all links, and is hot-pluggable.
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  • CXP
    CXP
    The Amphenol CXP connectors come in a one-piece press-fit assembly system with twelve channels of up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3b,a and the InfinibandCXP12x QDR standards. The CXP series is the fastest and most dense I/O on the market today. It enables pluggable copper or optical cables to increase the flexibility of system level hardware for end users, and offers reduced cross-talk. The CXP interconnect system offers plug-to-receptacle containment with the various EMI gasket and EMI spring finger options, and is ideal for network switches, routers, servers and storage devices.
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