The SMASH offers high robustness where signal integrity is required. Based on an aluminium shell with 1, 2 or 3 bays, the SMASH can house up to 450 contacts. The chevron grid pattern (1.905 x 1.905 [.075 x .75]) provides high contact density for advanced electronics packaging. The shell is equipped with grounding, guide pins, and keying devices to ensure mechanical reliability.
FEATURES AND BENEFITS
* High-density advanced SEM E modular connector
* Provide superior modules to backplane interconnects
* Flexible circuit terminations for a higher density